Our Technology

HotOzone™ Technology

HotOzone™ Technology comprises methods, processes, apparatus, treatment compositions, and treatment recipes that can be used for achieving very high surface treatment rates with ozone-solvent based treatment chemistries. This technology enables practical manufacturing throughput when ozone-based compositions are used in single substrate wet processing configurations. Treatment rates and material removal rates are 200 to 400 percent higher than rates obtainable with conventional ozone-based cleaning and surface treatment technology.

CuprOzone™ Technology

CuprOzone™ Technology comprises methods, processes, apparatus, treatment compositions, and treatment recipes that can be used for cleaning or treating device structures comprising copper using ozone-solvent based treatment chemistries, while not corroding or otherwise damaging exposed copper surfaces. The treatment compositions are selective and enable non-damaging cleaning and surface treatment of SiCOH low-k dielectric materials as well. One important group of applications comprise cleaning and surface treatment steps used in the manufacture of semiconductor device interconnect layers comprising copper conductors and SiCOH low-k dielectric materials. These BEOL applications include back-end-of-line post-etch resist and residue removal and post-CMP organic cleaning and copper passivation.

HotOzone™ Technology and CuprOzone™ Technology is covered by a number of issued and pending US and International Patents.